Curing oven
Primarily used for precision electronic packaging of chips, PCB components, and other electronic products, as well as for the mass production of semiconductor IC devices, sensors, and other components requiring high-temperature curing, reducing cross-contamination.
Capacity 6000L-24000L, various specifications available.
Module PID independent temperature control
A zoned automatic heating and cooling system allows for temperature adjustment.
Cooling fan accelerated cooling system
Automatic pressurization, pressure holding , and rotation system
Temperature and pressure monitoring system
Hydrogen storage tank rotation speed: adjustable
Process
1 to 6
Number of hydrogen storage tanks (units)
≤600mm
Hydrogen storage tank diameter (mm)
≤2200mm
Hydrogen storage tank length (mm)
Volume 6000L-24000L
Various specifications are available.
Various specifications are available.
Module PID independent temperature control
A zoned automatic heating and cooling system allows for temperature adjustment.
Cooling fan accelerated cooling system
Automatic pressurization, pressure holding, and rotation system
Temperature and pressure monitoring system
Hydrogen storage tank rotation speed: adjustable
Product Inquiry
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