Precise selection based on fluid viscosity (from 1 cPs to 500,000 cPs), equipped with time-pressure valves, screw valves, piezoelectric jet valves, etc., achieves adhesive volume control accuracy of up to ±1%, and micro-dispensing operations with a minimum dispensing diameter of 0.2 mm.

An integrated 3D vision system automatically identifies the workpiece position and compensates for offsets, ensuring precise dispensing paths.By using robots or precision motion platforms, continuous and uniform dispensing of adhesive along complex three-dimensional trajectories can be achieved, eliminating adhesive buildup or insufficient dispensing.

In the chip underfill process, vacuum adsorption and temperature control are used to ensure that the adhesive is fully filled without air bubbles; applied to Mini LED backlight packaging, this enables precise and efficient dispensing of phosphor adhesive to thousands of solder joints.