This article introduces Yuanwang Intelligent’s FUDE1850 series for semiconductor packaging and testing. The integrated system combines testing, sorting, marking, and taping, delivering UPH of 35,000–50,000, MTBA ≥60 min, and MTBF ≥168 hr. Compatible with multiple package types, it serves semiconductors, automotive electronics, and new energy sectors as a one-stop solution to boost production efficiency and chip quality.