Against the backdrop of the semiconductor industry's rapid evolution toward high integration, high reliability, and high computing power, semiconductor packaging and testing—as a critical back-end process in chip manufacturing—directly determines product performance, yield, and delivery efficiency. It serves as the core foundation for ensuring chip quality and enhancing market competitiveness. Leveraging over two decades of accumulated expertise in automation technology, Shenzhen Yuanwang Industrial Automation Co., Ltd. ("Yuanwang Intelligence") has launched the FUDE1850 series of equipment. This all-in-one solution delivers high precision and efficiency, enabling enterprises to optimize semiconductor packaging and testing processes and reduce production costs, precisely meeting the manufacturing needs of industries such as automotive electronics, new energy electronics, and semiconductors.
I. Core Product: FUDE1850 Series Fully Automated Equipment
Product Positioning:
The FUDE1850 series is an integrated system that combines electrical testing, vision-based sorting, laser marking, and tape-and-reel output, perfectly covering the entire semiconductor packaging and testing process.
Key Functional Highlights:
· Broad Compatibility: Supports a full range of chip types, including SOT, SOD, QFN, DFN, and SOP packages, meeting the adaptability requirements of semiconductor packaging and testing for diverse package forms.
· High-Efficiency Testing: Equipped with 8 test sites and TTL interfaces, enabling simultaneous multi-dimensional electrical testing to significantly improve process efficiency. The UPH (units per hour) reaches 35,000 to 50,000 pieces, with an MTBA (mean time between assists) of ≥60 minutes and an MTBF (mean time between failures) of ≥168 hours, greatly enhancing inspection efficiency and stability.
· Fully Automated Workflow: Integrates rotary positioning, vision inspection, and laser marking technologies to achieve unattended operation from material feeding to output.
II. Technical Expertise and Service Guarantee
Technical Advantages:
The equipment is built around high precision and high stability, utilizing precision motion control and vision compensation technology to ensure inspection accuracy and consistency in semiconductor packaging and testing. It is well-suited for applications demanding high reliability, such as automotive electronics and new energy electronics.
Comprehensive Services:
Yuanwang Intelligent provides full-chain support, including solution design, on-site commissioning, and technical maintenance, helping customers optimize semiconductor packaging and testing production lines and reduce overall costs.
III. Conclusion
With the FUDE1850 series equipment as its centerpiece, Yuanwang Intelligence is committed to enhancing the level of automation in the back-end processes of semiconductor manufacturing. Through professional equipment and services, the company empowers enterprises to achieve efficient upgrades in semiconductor packaging and testing, building a strong foundation for core competitiveness.
